Name: RELIFE SP-X medium temperature melting point 158℃ tin paste mobile phone PCB BGA / SMD template repair tin for x xs xsmax
SKU: BD1005001268357547
Price: 863.36 JPY
Availability: OutOfStock
Rating: 5 (1 reviews)

RELIFE SP-X medium temperature melting point 158℃ tin paste mobile phone PCB BGA / SMD template repair tin for x xs xsmax

RELIFE SP-X medium temperature melting point 158℃ tin paste mobile phone PCB BGA / SMD template repair tin for x xs xsmax

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~~¥ 1,092.88~~ 20% off

¥ 863.36

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安くて割引RELIFE SP-X medium temperature melting point 158℃ tin paste mobile phone PCB BGA / SMD template repair tin for x xs xsmax卸売。販売者Shop5972362 Storeから直接購入します。 ✓世界中で送料無料をお楽しみください！ ✓90日間のバイヤー保護。 ✓イージーリターン。 ✓返金保証。

RELIFE SP-X medium temperature melting point 158℃ tin paste mobile phone PCB BGA / SMD template repair tin for x xs xsmax

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